Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2)
Sources Sought from Department of Defense.
Data as of Oct 24, 2026. Sources: SAM.gov and Grants.gov. Snapshot govcon-directory-20261024T104923Z-2151694.
This product uses the Grants.gov API but is not endorsed or certified by the U.S. Department of Health and Human Services. Counts and totals are computed by DSE from public SAM.gov and Grants.gov notices. Text from Grants.gov may be shortened or have contact details removed. The original notice on Grants.gov is the authoritative version.
Closing in 3 days
Notice details
- Agency
- Department of Defense
- Sub-tier agency
- DEPT OF THE ARMY
- Notice type
- Sources Sought
- Solicitation number
- MicroelectronicsSourcingforTYAD2
- Product/service code
- 5962
- Place of performance
- Pennsylvania
- Posted
- Oct 9, 2026
- Response deadline
- Oct 27, 2026
- Source
- SAM.gov
Description
The U.S. Army Contracting Command (ACC) is issuing this Request for Information (RFI) as market research to identify qualified Original Component Manufacturers (OCMs) and their Tier-1 direct distributors (directly working with manufacturer) capable of supplying commercial-off-the-shelf (COTS), industrial, and defense-grade microelectronics in sustained, large-scale production volumes for Circuit Card Assembly (CCA) integration. The primary objective is to transition from spot-market, broker-dependent, and decentralized procurement models toward resilient, long-term, direct-tier relationships with primary component fabricators and direct suppliers. The Government seeks insights into volume production capacity, minimum lead times, wafer/die allocations, packaging assurances, and transparent chain-of-custody protocols. Disclaimer: This RFI is published solely for information and planning purposes. It does not constitute a Request for Proposal (RFP), Invitation for Bid (IFB), or an obligation on the part of the Government to acquire any products or services. The Government will not reimburse respondents for any costs incurred in preparing responses. See Attachment 1 - Request for Information for a full description of the Government's requirement for High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains.
Summarized from the official notice.
Official notice
Requirements and amendments are controlled by the official notice.
DSE verdict
The DSE fit verdict for this notice is available to DSE GovCon subscribers. It is not published on this page.
See DSE GovCon plans →Similar open notices
- Purchase 150 mm diameter SiC wafers with epitaxial layers for p-templates for IGBTsClosing in 2 days
- 59--DISPLAY,OPTOELECTROClosing in 3 days
- 59--MICROCIRCUIT,DIGITALClosing in 3 days
- 59--MICROCIRCUIT,LINEARClosing in 3 days
- 59--MICROCIRCUIT,LINEARClosing in 3 days
Get free alerts
Email alerts for notices like this one are free on DSE GovCon Intelligence.
Set up free alerts →Frequently asked questions
When is the response deadline?
The published deadline is Oct 27, 2026. That is 3 days after the data date.
What NAICS code applies?
NAICS 334413, Semiconductor and Related Device Manufacturing.
Which agency issued this notice?
Department of Defense.
Where is the official notice?
The link under Official notice opens the source listing.