Contract opportunity

Digital Backplane Assembly

Sources Sought from Department of Defense.

Data as of Oct 24, 2026. Sources: SAM.gov and Grants.gov. Snapshot govcon-directory-20261024T104923Z-2151694.

This product uses the Grants.gov API but is not endorsed or certified by the U.S. Department of Health and Human Services. Counts and totals are computed by DSE from public SAM.gov and Grants.gov notices. Text from Grants.gov may be shortened or have contact details removed. The original notice on Grants.gov is the authoritative version.

Closing in 37 days

Notice details

Agency
Department of Defense
Sub-tier agency
DEPT OF THE AIR FORCE
Notice type
Sources Sought
Solicitation number
FA8507_DPA_SourcesSought
NAICS
334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing
Product/service code
5840
Place of performance
Warner Robins, Georgia
Posted
Sep 29, 2026
Response deadline
Nov 30, 2026
Source
SAM.gov

Description

The United States Government is conducting market research to identify potential sources that may possess the expertise, capabilities, and experience to meet the requirements for qualification and production of X-Band Digital Backplane Aseembly. Security Requirements: The level of security clearance and amount of foreign participation in this requirement has not been determined; however, the Contractor should anticipate working with teams consisting of military, civilian, national partners, and contract personnel from various services and agencies. DISCLAIMER: THIS SOURCES SOUGHT IS FOR INFORMATIONAL PURPOSES ONLY. THIS IS NOT A REQUEST FOR PROPOSAL (RFP), REQUEST FOR QUOTE (RFQ) OR AN INVITATION FOR BID (IFB). IN ACCORDANCE WITH FAR 15.201(e), THIS NOTICE DOES NOT CONSTITUTE A SOLICITATION AND SHALL NOT BE CONSTRUED AS A COMMITMENT BY THE GOVERNMENT. RESPONSES IN ANY FORM ARE NOT OFFERS AND THE GOVERNMENT IS UNDER NO OBLIGATION TO AWARD A CONTRACT AS A RESULT OF THIS ANNOUNCEMENT.NO FUNDS ARE AVAILABLE TO PAY FOR PREPARATION OF RESPONSES TO THIS ANNOUNCEMENT. ANY INFORMATION SUBMITTED BY RESPONDENTS TO THIS TECHNICAL DESCRIPTION IS STRICTLY VOLUNTARY. THE GOVERNMENT MAY USE THE INFORMATION OBTAINED FROM RESPONSES TO THIS NOTICE IN DETERMINING ITS ACQUISITION APPROACH. THE ISSUANCE OF THIS NOTICE DOES NOT RESTRICT THE GOVERNMENT ACQUISTION APPROACH. The documents below contain a description of the DPA requirements, technical data package, and a Contractor Capability Survey

Summarized from the official notice. The description is shortened; read the full text on the official notice.

Official notice

View on SAM.gov →

Requirements and amendments are controlled by the official notice.

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Frequently asked questions

When is the response deadline?

The published deadline is Nov 30, 2026. That is 37 days after the data date.

What NAICS code applies?

NAICS 334418, Printed Circuit Assembly (Electronic Assembly) Manufacturing.

Which agency issued this notice?

Department of Defense.

Where is the official notice?

The link under Official notice opens the source listing.